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Hollow silicon microspheres, normally called Microballs, for epoxy resins and polyesters.
It appears as a very fine powder, weighing only 0.12 g / cc, added to the resin it reduces its specific weight, allowing it to be easily sanded once catalysis has taken place.
Excellent as a filler, as a putty and to facilitate the bonding of foams in the sandwich technique.
Quantity: 25 g
Τηλ: 210 5444 204 - Φαξ: 210 5444 384
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